Flexible PCB Product List and Ranking from 23 Manufacturers, Suppliers and Companies

Last Updated：Sep 24, 2025 Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

Flexible PCB Manufacturer, Suppliers and Company Rankings

Last Updated：Sep 24, 2025 Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

山下マテリアル Kanagawa//Electronic Components and Semiconductors
ステイ電子機器本社 Kanagawa//Electronic Components and Semiconductors
サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計 Shizuoka//Electronic Components and Semiconductors
4 スコットデザインシステム Osaka//Electronic Components and Semiconductors
5 沖電気工業産業営業本部　産業営業統括室 Tokyo//Information and Communications

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Flexible PCB Product ranking

Last Updated：Sep 24, 2025 Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
Business Introduction: "Design, Development, Manufacturing, and Sales of Flexible Printed Circuits (FPC)" ステイ電子機器本社
Flying lead flexible printed circuit board (FPC/flexible circuit board) サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Slit flexible substrate" *can also accommodate "twisting" and "torsion. 山下マテリアル
5 Multilayer flexible printed circuit board (multilayer FPC) スコットデザインシステム

Flexible PCB Product List

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Flexible printed circuit (FPC) low cost

We have a wealth of experience in custom and OEM projects.

■Features Flexible printed circuit boards (FPC boards) excel in flexibility and thinness, maintaining their electrical properties even when bent. The materials used for flexible printed circuit boards (FPC boards) include polyimide, known as coverlay, as an insulator, solder resist, and copper as the conductor. The basic structure of flexible printed circuit boards (FPC boards) consists of a film-like insulator with an adhesive layer formed on top, followed by a layer of conductor foil. The insulator covers and protects all areas except for the terminal and soldering sections. Produced in China, they are low-cost and ideal for value-added proposals. ■Specifications Base material thickness, copper foil thickness, copper foil type, coverlay color, resist color, and surface treatment will be manufactured according to customer specifications.

Company：日東商事横浜テックセンター
Price：Other

Other industrial robots
Notebook PC

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Flexible substrates that accommodate a wide range from prototype to mass production.

From prototype to mass production, we select the most suitable factory according to your needs! Supports single-sided and double-sided!

Our company is engaged in the export, import, and sales of printed circuit boards and electronic components. Our "Flexible Circuit Boards" are produced in suitable factories according to your needs, from prototype to mass production. We accommodate both single-sided and double-sided boards. 【Features】 ■ Supports from prototype to mass production ■ Single-sided and double-sided options available ■ Maximum size: 600mm x 600mm ■ Minimum pattern/clearance: 50um/50um. *For more details, please refer to the PDF document or feel free to contact us.

Company：サーリューション
Price：Other

Printed Circuit Board

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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance 　・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

Company：山一電機
Price：Other

Printed Circuit Board

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Flexible Printed Circuit (FPC) "Long-Length FPC"

Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.

The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.

Company：沖電線
Price：Other

Printed Circuit Board

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Transparent flexible printed circuit board (transparent FPC)

A transparent flexible substrate with wiring that cannot be seen with the naked eye.

It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.

Company：シライ電子工業 SPET事業部
Price：Other

Printed Circuit Board
Touch Panel
Sensors

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Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

It is a flexible substrate that combines heat resistance and transparency. FPC

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis

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Stretchable flexible printed circuit board (FPC/flexible board)

It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC

While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis

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Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

We propose an extremely thin and highly flexible FPC.

It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis

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Blind Via (BVH) connection Flexible Printed Circuit (FPC)

It is a flexible substrate effective for high-density wiring. FPC

Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis

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Low-loss flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

Company：山下マテリアル
Price：Other

Wiring materials

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High Current Compatible Flexible Circuit Board BigElec

The Big Elec flexible circuit board compatible with high current has three features.

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

Company：山下マテリアル
Price：100,000 yen-500,000 yen

Other electronic parts

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Low-rebound, high-speed transmission flexible substrate

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

Company：山下マテリアル
Price：100,000 yen-500,000 yen

Wiring materials

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High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

Company：山下マテリアル
Price：500,000 yen-1 million yen

Harness

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Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

Company：山下マテリアル
Price：Other

Wiring materials

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Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.